Konka LED48M1200AF U disk installation application market

Konka LED48M1200AF installs a sofa butler via a USB stick. Konka other models can also refer to this tutorial.

Installation procedure 1 Download the sofa butler installation file to U disk → 2U disk to connect to Konka TV → 3 Jinshan Guard enter U disk installation package management → 4 Installation is completed

Steps
1. Baidu search for "sofa manager" into the sofa network, download the sofa butler package; or directly click the link (http://app.shafa.com/shafa.apk) to download the sofa butler package.


Copy the downloaded apk installation package to the U disk.

2. Put a USB flash drive on the TV, and Jinshan Guard on the TV desktop to open the installation package management.


3. In the Jinshan Guard → Install Package Manager, find the downloaded sofa butler installation file and confirm the installation.


4. Wait a moment to complete the installation. Afterwards, you only need to download any TV version application through the sofa butler, which is very convenient.



If you still can not read the U disk, it is recommended to format the U disk to FAT32 format (if there are other contents in the U disk, export and then format), or try another U disk.

If the installation fails, restart the device and try again by following the steps (may be useful). Still have questions please add the official QQ group below.

Watch on-demand video on smart TV, recommend using pudding video; Watch live TV, recommend HDP live broadcast; More interesting content, please use Tencent video TV version, TV; Fun smart TV and box, more exciting content in Sofa net.

Do you know what is ENEPIG in PCB?
 What is ENEPIG?ENEPIG-Electroless Nickel Electroless Palladium Immersion Gold is a surface finish for Printed Circuit Boards.ENEPIG works well with lead free and conventional eutectic solder alloys.This is the best way for gold wire bonding. Advantages for ENEPIG:

1.[Black Nickel" free – no possibility of grain boundary corrosion of nickel surface by immersion gold
2.Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus ensuring good solderability
3.Palladium completely dissolves into solder, without leaving an excessively high P% rich interface, exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic
5.Withstands multiple lead-free reflow soldering cycles
6.Demonstrates excellent gold wire bondability

7.Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold


ENEPIG PCB

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