Acmecools Tech. Ltd. is a leading thermal conductivity component manufacturer whose isothermal (hot) board has been successfully proven for use in the cloud (high-end servo server and graphics card), communication and high-power illumination. Cooling applications in the industry of LED (LED) lighting, electric vehicles and solar energy can solve the impact of product reliability and performance, and can effectively improve its stability and then import into the market.
Vapor Chamber, a high-performance isothermal (hot) board developed by Extreme Technology and the R&D team in the United States, is characterized by its ability to easily assist electronic products in achieving light, thin, short, and small requirements, and is the world's first solderless The production technology of the uniform temperature (heat) plate of the injection pipe; in addition to the characteristics of no specific hot zone and directionality, it is more characterized by customization and assembly. It not only has the original patent protection independently developed, but also passes the testing of domestic and foreign authoritative certification units, which far exceeds the sub-type products of the existing market in terms of price, function and product reliability.
The LED itself generates temperature during operation, and with today's package characteristics, heat is not easily dissipated. In order to reduce LED thermal exhaustion and extend life, the industry can only rely on large-area heat sinks. The large-area heat sink of LED has long been a bottleneck that LED lighting cannot avoid, but it also indirectly forms the glare and performance flaws, and constitutes the harm of the eyes. Therefore, to solve the above concerns, the design of the thermal module is absolutely the key. Under the good heat dissipation design, the product can achieve stable luminous efficiency and quality, thereby reducing heat exhaustion and improving the life of the product and peripheral components. There are several different interpretations of the thermal module, but how to effectively and truly derive the high heat of the die, and provide industry standards and specifications, and then lead to design, manufacturing, safety management, etc., the LED industry is currently eager Looking for.
Due to the excellent uniform temperature and conduction characteristics of the uniform temperature (heat) plate, the "point" of high heat flux density can be instantaneously extended to a large heat dissipation field, and heat is radiated by the heat dissipation fins. The principle is nothing more than the capillary structure of the inner wall, the vacuum chamber and the liquid phase of the liquid substance.
In view of the so-called average temperature (hot) plate on the market, it refers to the material (Cold Plate, not Vapor Chamber), such as: Copper plate, Aluminum plate, Ceramic plate, Graphite. Plate (Graphite), etc., not the high-efficiency thermally conductive vacuum element for true gas phase heat transfer as referred to in this product.
At present, the heat dissipation and module industry claims to have patents for uniform temperature (heat) boards, but most of them belong to manufacturing and manufacturing patents. Not only have they failed to pass the testing of authoritative certification units at this stage, but they cannot achieve the goal of rapid quantification.
At present, in response to the requirements of internationally renowned manufacturers, this product has been officially launched by Extreme Technology Co., Ltd. and is openly authorized to manufacture uniform temperature (heat) boards to meet the needs of customers and the market.
Vapor Chamber, a high-performance isothermal (hot) board developed by Extreme Technology and the R&D team in the United States, is characterized by its ability to easily assist electronic products in achieving light, thin, short, and small requirements, and is the world's first solderless The production technology of the uniform temperature (heat) plate of the injection pipe; in addition to the characteristics of no specific hot zone and directionality, it is more characterized by customization and assembly. It not only has the original patent protection independently developed, but also passes the testing of domestic and foreign authoritative certification units, which far exceeds the sub-type products of the existing market in terms of price, function and product reliability.
The LED itself generates temperature during operation, and with today's package characteristics, heat is not easily dissipated. In order to reduce LED thermal exhaustion and extend life, the industry can only rely on large-area heat sinks. The large-area heat sink of LED has long been a bottleneck that LED lighting cannot avoid, but it also indirectly forms the glare and performance flaws, and constitutes the harm of the eyes. Therefore, to solve the above concerns, the design of the thermal module is absolutely the key. Under the good heat dissipation design, the product can achieve stable luminous efficiency and quality, thereby reducing heat exhaustion and improving the life of the product and peripheral components. There are several different interpretations of the thermal module, but how to effectively and truly derive the high heat of the die, and provide industry standards and specifications, and then lead to design, manufacturing, safety management, etc., the LED industry is currently eager Looking for.
Due to the excellent uniform temperature and conduction characteristics of the uniform temperature (heat) plate, the "point" of high heat flux density can be instantaneously extended to a large heat dissipation field, and heat is radiated by the heat dissipation fins. The principle is nothing more than the capillary structure of the inner wall, the vacuum chamber and the liquid phase of the liquid substance.
In view of the so-called average temperature (hot) plate on the market, it refers to the material (Cold Plate, not Vapor Chamber), such as: Copper plate, Aluminum plate, Ceramic plate, Graphite. Plate (Graphite), etc., not the high-efficiency thermally conductive vacuum element for true gas phase heat transfer as referred to in this product.
At present, the heat dissipation and module industry claims to have patents for uniform temperature (heat) boards, but most of them belong to manufacturing and manufacturing patents. Not only have they failed to pass the testing of authoritative certification units at this stage, but they cannot achieve the goal of rapid quantification.
At present, in response to the requirements of internationally renowned manufacturers, this product has been officially launched by Extreme Technology Co., Ltd. and is openly authorized to manufacture uniform temperature (heat) boards to meet the needs of customers and the market.
(This article is the ultimate technology submission)
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