LED Lamp (led lamp) is mainly composed of five materials: bracket, silver glue, wafer, gold wire and epoxy resin.
First, the bracket:
1), the role of the bracket: for conduction and support
2) The composition of the bracket: The bracket is formed by electroplating of the bracket material, and is composed of five layers of material, copper, nickel, copper and silver from inside to outside.
3), the type of bracket: with a cup holder for concentrating type, flat head bracket for a large angle astigmatism type Lamp.
A, 2002 cup / flat head: This kind of bracket generally does not require high angle and brightness, and its Pin length is about 10mm shorter than other brackets. Pin spacing is 2.28mm
B, 2003 cup / flat head: generally used to make a φ5 or more Lamp, the exposed pin length is +29mm, -27mm. The pin pitch is 2.54 mm.
C, 2004 cup / flat head: used to do the φ3 or so of the Lamp, Pin length and spacing with the 2003 bracket.
D, 2004LD/DD: used to make blue, white, pure green, purple Lamp, can be welded double line, the cup is deep.
E, 2006: Both poles are flat-head type, used for flashing Lamp, solid IC, welding multiple lines.
F, 2009: used to make a two-color Lamp, two wafers can be fixed in the cup, and three pin feet control the polarity.
G, 2009-8/3009: used to make a three-color Lamp, three chips in the cup, four pin feet.
Second, silver glue
The role of silver glue: the role of fixing the wafer and conducting electricity.
The main components of silver glue: silver powder accounts for 75-80%, EPOXY (epoxy resin) accounts for 10-15%, and additives account for 5-10%.
Use of silver glue: refrigerate, need to be thawed and fully stirred before use. After the silver glue is left for a long time, the silver powder will precipitate. If it is not stirred evenly, it will affect the performance of the silver glue.
Third, the chip (Chip):
Light-emitting diode and LED chip structure
1), the role of the wafer: the wafer is the main component of the LED Lamp, is a luminescent semiconductor material.
2) Composition of the wafer: The wafer is made of gallium phosphide (GaP), gallium aluminum arsenide (GaAlAs) or gallium arsenide (GaAs), gallium nitride (GaN), etc., and its internal structure has unidirectional conductivity.
3), the structure of the wafer:
Solder single-wire positive (P/N structure) wafer, two-wire wafer. Wafer size unit: mil
The pads of the wafer are typically gold pads or aluminum pads. The shape of the pad is circular, square, cross, and the like.
4), the color of the wafer:
The color of the luminescence of the wafer depends on the wavelength. The classification of common visible light is roughly: dark red (700 nm), deep red (640-660 nm), red (615-635 nm), amber (600-610 nm), yellow (580-595 nm). Yellow-green (565-575 nm), pure green (500-540 nm), blue (450-480 nm), purple (380-430 nm).
White light and pink light are a mixture of light effects. The most common is a mixture of blue + yellow phosphor and blue + red phosphor.
5), the main technical parameters of the wafer:
A, volt-ampere characteristics of the wafer:
B. Forward Voltage (VF): A voltage applied across the wafer to cause the wafer to conduct. This voltage is related to the wafer itself and the test current. If the VF is too large, the wafer will be broken down.
C. Forward current (IF): The forward conduction current generated by the wafer after a certain voltage is applied. The size of the IF is related to the magnitude of the forward voltage. The operating current of the wafer is around 10-20 mA.
D. Reverse Voltage (VR): The reverse voltage applied to the wafer.
E. Reverse current (IR): refers to a leakage current generated by the wafer after a reverse voltage is applied. The smaller the current, the better. Because the current is large, the wafer is easily reversed.
F, brightness (IV): refers to the brightness of the light source. Unit conversion: 1cd=1000mcd
G. Wavelength: reflects the luminescent color of the wafer. Wafers of different wavelengths have different illuminating colors. Unit: nm
H, light: is a kind of electromagnetic wave. Electromagnetic waves having a wavelength of 0.1 mm to 10 nm are called light.
Light can be divided into: wavelength greater than 0.1mm is called radio wave; 760nm-0.1nm is called infrared light; 380nm-760nm is called visible light; 10nm-380nm is called ultraviolet light; and wavelength less than 10nm is X-ray light.
Fourth, the gold line:
The role of the gold wire: connect the wafer PAD (pad) to the bracket and make it conductive.
The purity of the gold wire is 99.99% Au; the elongation is 2-6%, and the size of the gold wire is 0.9 mil, 1.0 mil, 1.1 mil, and the like.
5. Epoxy resin:
The role of epoxy resin: to protect the internal structure of the Lamp, can slightly change the color, brightness and angle of the Lamp; shape the Lamp.
The encapsulating resin comprises four parts: A glue (main agent), B glue (hardener), DP (diffusion agent), and CP (colorant). Its main components are epoxy resin (Epoxy Resin), acid anhydride (anhydride), high light diffusing filler (Light diffusion) and thermal stability dye (dye).
Six, the mold:
The mold strip is a mold for forming a Lamp, and generally has a circular shape, a square shape, a tower shape, and the like. The depth of the stent is determined by the height of the card. The mold strips should be stored in a clean and below room temperature environment, otherwise it will affect the appearance of the product.
Flexible PCB
Flexible Printed Circuit boards derive their name for their ability to enable the circuitry to be designed to fit the electronic device or product, as opposed to building the device to conform with the Circuit Board . Flex boards are characterized by a distinctly patterned printed circuitry and component arrangement highlighted by a malleable base material.
Exploring the Many Advantages of Flex Circuit Boards
Flexible Printed Circuit Boards offer a number of potential benefits including:
• Saving Space: Flex PCB design requires only about 10 percent of the space and weight of a wired circuit board assembly, offering greater installation and packaging freedom. The inherent flexibility also permits tighter bend capabilities.
• Maximum Reliability: A flexible Printed Circuit Board requires fewer interconnects, which in turn require fewer contact crimps, connectors and solder joints. Simply put, a Flexible PCB Board does not contain as many potential sources for failure, which enhances their reliability.
• Enhanced Capabilities: The flexible PCB is compatible with virtually any type of connector or component and works well with options such as ZIP connectors. They also perform extremely well in extreme temperatures and offer superior resistance to radiation and chemicals.
• Cost Savings: Cost-saving advantages of flexible printed circuits include reduced material and packaging requirements, lower parts replacement costs and a reduction in assembly errors that could otherwise result in the need for repairs.
All of these benefits make flex circuit boards ideally suited for a wide range of applications in industries such as Military, Transportation, Medical, Consumer Electronics, Automotive, Aerospace, Communications and Industrial.
BentePCB: A Leading Flex PCB Manufacturer for More Than a Decade
At BentePCB, we specialize in the fabrication and assembly of flexible printed circuit products for use in the manufacturing of medical devices and various types of telecommunication and industrial equipment. Our Custom PCB manufacturing capabilities allow us to develop and produce a top-performing flex PCB that meets your unique requirements. We can also work with you to produce a custom flex PCB Prototype that will significantly improve your prospects of a successful project outcome. Detailed capabilities please refer to the following form.
Item |
Capability |
Quality Grade |
Standard IPC 2 |
Number of Layers |
1 - 8layers |
Build Time |
2days - 30days |
Material |
DuPont PI, Domestic Shengyi PI |
Board Size |
Min 6*6mm, Max 406*610mm |
Board Thickness |
0.08mm - 0.6mm |
Finished board thickness tolerance 0.085mm≦board thickness<0.4mm |
±2mil(±0.04m) |
Outer Layer Base Copper Thickness |
0.3oz - 1.0oz |
Min Tracing/Spacing |
2.5mil/2.5mil |
Min. Annular Ring |
4mil |
Min. Drilling Hole Diameter |
8mil(0.2mm) |
Min. hole size---Drilling |
8mil(0.2mm) |
Min. finished via diameter |
6mil(0.15mm) |
Tolerance of dimension |
3mil(0.076 mm) |
Solder Mask Sides |
As per the file |
Solder Mask Color |
Green, White, Blue, Black, Red, Yellow |
Solder-stop coating---Soldermask oil |
Green, White, Blue, Black, Red, Yellow |
Solder-stop coating---Coverlay |
PI and PET film |
Silkscreen Sides |
As per the file |
Silkscreen Color |
White, Black, Yellow |
Surface Finish |
OSP
HASL - Hot Air Solder Leveling Flash Gold (Soft Gold) Gold Plated Immersion Silver Immersion Tin |
Other Techniques |
Peelable
solder mask |
About Us:
BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB , rigid PCB and flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volumn.
Why Us?
UL (E492586), ISO9001, ISO14001, TS16949, RoHS certified.
Turnover USD 10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 16 layers.
Special Material:ROGERS, Arlon, Taconic.etc.
Client:Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.
Certification(UL:E492586, TS16949, ISO14001, ISO9001,RoHS):
Factory Tour:
Exhibition:
We Took part in the famous exhibitions over the past years,and got highly appreciation from the top experts,as well as cooperated tightly with them.
Delivery:
BentePCB offers flexible shipping methods for our customers, you may choose from one of the methods below.
FAQ:
Q1: What does BentePCB need for a customized PCB order?
A: The customers need to provide Gerber or pcb file.If you do not have the file in the correct format, you can send all the details related to the products.
Q2: What is your quotation policy?
A: For the PCB order in large quantity, BentePCB will send you the quotation based on the MOQ of the products concerned, and the price will be reasonable with good quality.
Q3: How long will you send us quotation ?
A: After all files were sent, 2 to 8 hours as per your file.
Q4:What is your minimum order quantity?
A:Our MOQ is 1 PCS.
We don`t just sell PCBs .We sell sleep.
Flexible PCB
Flexible PCB, Flexible PCB Prototype, Flexible Circuit Board, Flexible Printed Circuit
Shenzhen Bente Circuit Limited , http://www.bentegroup.com